New flagship chipset from MediaTek, the Dimensity 9200, features ARM Cortex-X3 CPU and Immortalis-G715 GPU cores built on the TSMC N4P node.
The Dimensity 9200, MediaTek's newest flagship chipset and the company's first to feature ARM's Cortex-X3 GPU, has been introduced. The Dimensity 9200, which is based on the TSMC N4P node, guarantees to give superior performance over the Dimensity 9000 while using much less power.
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| Before the start of the year, premium smartphones with the MediaTek Dimensity 9200 should be available. (Image source: MediaTek) |
The newest 5G chipset from MediaTek, the Dimensity 9200, has been made public. The Dimensity 9200, touted as being created to power "the next era of flagship smartphones," is the first smartphone SoC in the world to include an ARM Cortex X3 CPU core. The Immortalis-G715, a GPU from ARM that offers hardware-based ray tracing and Wi-Fi 7 Ready connectivity, is also featured for the first time in the Dimensity 9200.
The Dimensity 9200 is also said to be the first device from MediaTek to feature an RGBW ISP and LPDDR5X RAM operating at 8533 Mbps. The Dimensity 9200 also uses the second-generation Armv9 architecture from ARM and the second-generation 4 nm N4P manufacturing process from TSMC. To serve as a point of comparison, MediaTek equipped the Dimensity 9200 with the following CPU cores:
- 1x Cortex-X3 - 3.05 GHz
- 3x Cortex-A715 - 2.85 GHz
- 4x Cortex-A510 - 1.8 GHz


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